|
|
|
|
1.What is Thin Film ?
■What is Thin Film ?
|
THIN FILM cannot exist by itself
- Needs substrates to adhere to
- The surface condition of the substrate influence the characteristics of the film
THIN FILM has different characteristics from bulk metal
- Thin film's features mostly come from its thinness
THIN FILM is created through atomic/molecular processes
- Atoms/molecules are highly energized with heat or electrical power in vacuum chamber and build up one by one through chemical or physical reactions..
|
2.Let's compare to human height and earth's diameter!
■Let's compare to human height and earth's diameter! |
 |
 |
■Technical Speaking Definition |
 |
|
 |
3.Features of Thin Film
■SSM's Deposition Technology |
| Physical Method (PVD: Physical vapor deposition)
- Resistive heating vacuum evaporation (NiCr,Cu,Ni,Au etc.)
- Electron beam evaporation (Ni,Al etc.)
- Sputtering (NiCr,Cr Alloy, Cu)
- Ion plating (Ni,Cr etc.)
Chemical Method (CVD: Chemical vapor deposition)
- Plasma CVD (SiO2, SiN etc.)
- Plasma polymerization reaction (SiN etc.)
Others
- Electro-plating (Cu, Ni, Au, Solder etc.)
- Electroless-plating (Au, Ni Alloy etc.)
|
|
■Sputtering Method (Planer Magnetron) |
Highly energized argon gas plasma bombards the target surface, "sputtering" out target atoms/molecules onto the substrate surface. |
|
| Features
- Thin film purity is quite high.
- Target alloy composition is represented as is in the thin film.
- Most metal and semi-conductor material can be sputtered.
- Thin-film's adhesion to substrates is very strong.
|
|
■Plasma CVD / Plasma polymerization reaction |
The raw materials are introduced as gas and they become plasma under very high AC or DC power.
The gas plasma goes through chemical reaction over the surface of the substrates creating thin films. |
|
|
Features
- Low temperature reaction eliminate heat stress in the thin film..
- Non-metallic including some organic film can be deposited.,
- Film is virtually defect (such as pin holes) free.
- Suitable for non-crystalline thin film
|
■Advantage of Thin Film |
| Uniformity |
・Low noise due to evenness and less defects
・Precise & accurate
・Stable and reliable ( against temperature, humidity and age) |
| Thin |
・Low floating capacitance between neighboring elements
(Thickness 0.1µm -0.01µm)
・Excellent high frequency characteristics into GHz range |
| Strong adhesion |
・Stable and reliable ( against temperature, humidity and age)
・Excellent terminal strength |
| Easy to Process |
・Enable micro and precise patterning/processing.,
・Enable low profile multi-layer structure.
・Fit for miniaturization |
| Other features |
・Linear temperature coefficient |
|
|
|
|
