Specialists in Thin Film Technology
SUSUMU INTERNATIONAL U.S.A.

Thin film and Susumu ・ What is Thin Film ? ・ Products Development History Product technical report Application notes ・ PC applications ・ RF applications ・ Automotive applications ・ Power source applications Technical customer service ・ Recommended land pattern ・ Recommended reflow temperature profile ・ Reel Specification ・ Tape specification ・ Power derating curve

Recommended reflow temperature profile ■Part's surface temperature Pre-heat 130～180°C 60～90sec. reflow Over 220°C 30～90 seconds peak temperature 240～250°C within 10 seconds ■Solder composition:Sn-Ag-Cu solder ■Repetition:up to 2 times Cooling between the two reflow is required.